JM

Jack A. Mandelman

IBM: 9 patents #55 of 5,214Top 2%
Infineon Technologies Ag: 3 patents #199 of 1,152Top 20%
📍 Underhill, VT: #1 of 23 inventorsTop 5%
🗺 Vermont: #10 of 502 inventorsTop 2%
Overall (2005): #1,497 of 245,428Top 1%
9
Patents 2005

Issued Patents 2005

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
6979851 Structure and method of vertical transistor DRAM cell having a low leakage buried strap Dureseti Chidambarrao, Carl Radens 2005-12-27
6974743 Method of making encapsulated spacers in vertical pass gate DRAM and damascene logic gates Ramac Divakaruni, Stephan Kudelka 2005-12-13
6972220 Structures and methods of anti-fuse formation in SOI Claude L. Bertin, Ramachandra Divakaruni, Russell J. Houghton, William R. Tonti 2005-12-06
6967137 Forming collar structures in deep trench capacitors with thermally stable filler material Michael P. Belyansky, Rama Divakaruni, Dae-Gyu Park 2005-11-22
6911687 Buried bit line-field isolation defined active semiconductor areas Gerhard Kunkel 2005-06-28
6909137 Method of creating deep trench capacitor using a P+ metal electrode Ramachandra Divakaruni, Dae-Gyu Park 2005-06-21
6897107 Method for forming TTO nitride liner for improved collar protection and TTO reliability Rama Divakaruni, Thomas W. Dyer, Rajeev Malik, Venkatachajam C. Jaiprakash 2005-05-24
6872620 Trench capacitors with reduced polysilicon stress Dureseti Chidambarrao, Rajarao Jammy 2005-03-29
6869846 Forming electronic structures having dual dielectric thicknesses and the structure so formed Louis L. Hsu, Carl Radens, Richard Strub, William R. Tonti 2005-03-22