Issued Patents 2005
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974915 | Printed wiring board interposer sub-assembly and method | William L. Brodsky, Benson Chan, Michael A. Gaynes | 2005-12-13 |
| 6967389 | Wafer with semiconductor chips mounted thereon | William Infantolino, Sanjeev Sathe, George H. Thiel | 2005-11-22 |
| 6961995 | Method of making an electronic package | Lisa J. Jimarez, Miguel A. Jimarez, Cynthia S. Milkovich, Charles H. Perry, Brenda Peterson | 2005-11-08 |
| 6929900 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Donald S. Farquhar, Claudius Feger, Konstantinos I. Papathomas, Mark D. Poliks, Jane M. Shaw +2 more | 2005-08-16 |
| 6924224 | Method of forming filled blind vias | Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, Manh-Quan Nguyen | 2005-08-02 |
| 6900392 | Information handling system utilizing circuitized substrate | James W. Fuller, John M. Lauffer | 2005-05-31 |
| 6894228 | High performance dense wire for printed circuit board | Donald O. Anstrom, Bruce J. Chamberlin, John M. Lauffer, David L. Thomas | 2005-05-17 |
| 6892451 | Method of making an interposer sub-assembly in a printed wiring board | William L. Brodsky, Benson Chan, Michael A. Gaynes | 2005-05-17 |
| 6872894 | Information handling system utilizing circuitized substrate | James W. Fuller, John M. Lauffer | 2005-03-29 |
| 6868604 | Method for forming an electrical structure | John S. Kresge | 2005-03-22 |
| 6852152 | Colloidal seed formulation for printed circuit board metallization | Raymond T. Galasco, Roy H. Magnuson, Thomas R. Miller, Anita Sargent, William E. Wilson | 2005-02-08 |
| 6848914 | Electrical coupling of substrates by conductive buttons | Brian S. Beaman, William L. Brodsky, James A. Busby, Benson Chan, Charles H. Perry | 2005-02-01 |