Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974915 | Printed wiring board interposer sub-assembly and method | William L. Brodsky, Benson Chan, Voya R. Markovich | 2005-12-13 |
| 6949415 | Module with adhesively attached heat sink | David J. Alcoe, Thomas W. Dalrymple, Randall J. Stutzman | 2005-09-27 |
| 6892451 | Method of making an interposer sub-assembly in a printed wiring board | William L. Brodsky, Benson Chan, Voya R. Markovich | 2005-05-17 |
| 6893523 | Method for bonding heat sinks to overmold material | William R. Hill | 2005-05-17 |
| 6893591 | Thermoplastic adhesive preform for heat sink attachment | John G. Davis, Joseph D. Poole | 2005-05-17 |