Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6978542 | Method of reforming reformable members of an electronic package and the resultant electronic package | — | 2005-12-27 |
| 6949415 | Module with adhesively attached heat sink | Thomas W. Dalrymple, Michael A. Gaynes, Randall J. Stutzman | 2005-09-27 |
| 6887779 | Integrated circuit structure | Francis J. Downes, Jr., Gerald W. Jones, John S. Kresge, Cheryl L. Tytran-Palomaki | 2005-05-03 |
| 6879492 | Hyperbga buildup laminate | Kim J. Blackwell | 2005-04-12 |