TD

Thomas W. Dalrymple

IBM: 1 patents #1,781 of 5,214Top 35%
📍 Endicott, NY: #26 of 59 inventorsTop 45%
🗺 New York: #2,313 of 8,003 inventorsTop 30%
Overall (2005): #89,295 of 245,428Top 40%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6949415 Module with adhesively attached heat sink David J. Alcoe, Michael A. Gaynes, Randall J. Stutzman 2005-09-27