BC

Benson Chan

IBM: 3 patents #481 of 5,214Top 10%
ET Endicott Interconnect Technologies: 1 patents #4 of 7Top 60%
📍 Vestal, NY: #3 of 52 inventorsTop 6%
🗺 New York: #382 of 8,003 inventorsTop 5%
Overall (2005): #13,641 of 245,428Top 6%
4
Patents 2005

Issued Patents 2005

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6974915 Printed wiring board interposer sub-assembly and method William L. Brodsky, Michael A. Gaynes, Voya R. Markovich 2005-12-13
6964884 Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same John M. Lauffer 2005-11-15
6892451 Method of making an interposer sub-assembly in a printed wiring board William L. Brodsky, Michael A. Gaynes, Voya R. Markovich 2005-05-17
6848914 Electrical coupling of substrates by conductive buttons Brian S. Beaman, William L. Brodsky, James A. Busby, Voya R. Markovich, Charles H. Perry 2005-02-01