JL

John M. Lauffer

ET Endicott Interconnect Technologies: 3 patents #1 of 7Top 15%
IBM: 1 patents #1,781 of 5,214Top 35%
📍 Waverly, NY: #1 of 3 inventorsTop 35%
🗺 New York: #382 of 8,003 inventorsTop 5%
Overall (2005): #11,718 of 245,428Top 5%
4
Patents 2005

Issued Patents 2005

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6964884 Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same Benson Chan 2005-11-15
6900392 Information handling system utilizing circuitized substrate James W. Fuller, Voya R. Markovich 2005-05-31
6894228 High performance dense wire for printed circuit board Donald O. Anstrom, Bruce J. Chamberlin, Voya R. Markovich, David L. Thomas 2005-05-17
6872894 Information handling system utilizing circuitized substrate James W. Fuller, Voya R. Markovich 2005-03-29