Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6852152 | Colloidal seed formulation for printed circuit board metallization | Raymond T. Galasco, Roy H. Magnuson, Voya R. Markovich, Thomas R. Miller, Anita Sargent | 2005-02-08 |