Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972209 | Stacked via-stud with improved reliability in copper metallurgy | Birendra Agarwala, Conrad A. Barile, Hormazdyar M. Dalal, Brett H. Engle, Michael Lane +8 more | 2005-12-06 |
| 6939797 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane +3 more | 2005-09-06 |
| 6914320 | Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof | Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Terence L. Kane, Naftall E. Lustig +5 more | 2005-07-05 |
| 6887783 | Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof | Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Terence L. Kane, Naftall E. Lustig +5 more | 2005-05-03 |