Issued Patents 2005
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960396 | Pb-free solder-connected structure and electronic device | Hanae Shimokawa, Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka +1 more | 2005-11-01 |
| 6949416 | Method of manufacturing a semiconductor integrated circuit device | Toshio Miyamoto, Ichiro Anjo, Yoshihide Yamaguchi | 2005-09-27 |
| 6946723 | Semiconductor device and manufacturing method thereof | Toshiya Satoh, Masahiko Ogino, Tadanori Segawa, Yoshihide Yamaguchi, Hiroyuki Tenmei +2 more | 2005-09-20 |
| 6946327 | Semiconductor device and manufacturing method of that | Toshio Miyamoto, Ichiro Anjo, Mitsuaki Katagiri, Yuji Shirai, Yoshihide Yamaguchi | 2005-09-20 |
| 6940162 | Semiconductor module and mounting method for same | Shuji Eguchi, Akira Nagai, Haruo Akahoshi, Takumi Ueno, Toshiya Satoh +3 more | 2005-09-06 |
| 6930388 | Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure | Yoshihide Yamaguchi, Hiroyuki Tenmei, Kosuke Inoue, Noriyuki Oroku, Hiroshi Hozoji +6 more | 2005-08-16 |
| 6927489 | Semiconductor device provided with rewiring layer | Akihiro Yaguchi, Hideo Miura, Atsushi Kazama | 2005-08-09 |
| 6919622 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more | 2005-07-19 |
| 6900074 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING PLURAL SEMICONDUCTOR CHIPS, WHEREIN ELECTRODES OF THE SEMICONDUCTOR CHIPS ARE ELECTRICALLY CONNECTED TOGETHER VIA WIRING SUBSTRATES OF THE SEMICONDUCTOR CHIPS | Toshio Miyamoto, Koki Noguchi, Satoshi Michishita, Masashi Horiguchi, Masaharu Kubo +1 more | 2005-05-31 |
| 6888230 | Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device | Masahiko Ogino, Takumi Ueno, Shuji Eguchi, Akira Nagai, Toshiya Satoh +5 more | 2005-05-03 |
| 6882039 | Semiconductor device | Hiroya Shimizu, Tosiho Miyamoto, Hideki Tanaka, Hideo Miura | 2005-04-19 |
| 6869008 | Method of forming bumps | Kosuke Inoue, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima +1 more | 2005-03-22 |
| 6861742 | Wafer level chip size package having rerouting layers | Toshio Miyamoto, Ichiro Anjo, Mitsuaki Katagiri, Yuji Shirai, Yoshihide Yamaguchi | 2005-03-01 |
| 6844219 | Semiconductor device and lead frame therefor | Makoto Kitano, Akihiro Yaguchi, Naotaka Tanaka, Takeshi Terasaki, Ichiro Anjoh +2 more | 2005-01-18 |