Issued Patents 2005
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949416 | Method of manufacturing a semiconductor integrated circuit device | Toshio Miyamoto, Asao Nishimura, Yoshihide Yamaguchi | 2005-09-27 |
| 6946327 | Semiconductor device and manufacturing method of that | Toshio Miyamoto, Asao Nishimura, Mitsuaki Katagiri, Yuji Shirai, Yoshihide Yamaguchi | 2005-09-20 |
| 6946723 | Semiconductor device and manufacturing method thereof | Toshiya Satoh, Masahiko Ogino, Tadanori Segawa, Yoshihide Yamaguchi, Hiroyuki Tenmei +2 more | 2005-09-20 |
| 6940162 | Semiconductor module and mounting method for same | Shuji Eguchi, Akira Nagai, Haruo Akahoshi, Takumi Ueno, Toshiya Satoh +3 more | 2005-09-06 |
| 6930388 | Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure | Yoshihide Yamaguchi, Hiroyuki Tenmei, Kosuke Inoue, Noriyuki Oroku, Hiroshi Hozoji +6 more | 2005-08-16 |
| 6919622 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Asao Nishimura +19 more | 2005-07-19 |
| 6861742 | Wafer level chip size package having rerouting layers | Toshio Miyamoto, Asao Nishimura, Mitsuaki Katagiri, Yuji Shirai, Yoshihide Yamaguchi | 2005-03-01 |