Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6940162 | Semiconductor module and mounting method for same | Shuji Eguchi, Akira Nagai, Takumi Ueno, Toshiya Satoh, Masahiko Ogino +3 more | 2005-09-06 |
| 6924971 | High dielectric constant composite material and multilayer wiring board using the same | Yuichi Satsu, Akio Takahashi, Tadashi Fujieda, Takumi Ueno | 2005-08-02 |
| 6900394 | Electroless copper plating machine, and multi-layer printed wiring board | Takeyuki Itabashi, Tadashi Iida, Yoshinori Ueda, Eiji Takai, Naoki Nishimura | 2005-05-31 |