Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949416 | Method of manufacturing a semiconductor integrated circuit device | Toshio Miyamoto, Ichiro Anjo, Asao Nishimura | 2005-09-27 |
| 6946327 | Semiconductor device and manufacturing method of that | Toshio Miyamoto, Ichiro Anjo, Asao Nishimura, Mitsuaki Katagiri, Yuji Shirai | 2005-09-20 |
| 6946723 | Semiconductor device and manufacturing method thereof | Toshiya Satoh, Masahiko Ogino, Tadanori Segawa, Hiroyuki Tenmei, Atsushi Kazama +2 more | 2005-09-20 |
| 6930388 | Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure | Hiroyuki Tenmei, Kosuke Inoue, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2005-08-16 |
| 6861742 | Wafer level chip size package having rerouting layers | Toshio Miyamoto, Ichiro Anjo, Asao Nishimura, Mitsuaki Katagiri, Yuji Shirai | 2005-03-01 |