Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949203 | System level in-situ integrated dielectric etch process particularly useful for copper dual damascene | Chang-Lin Hsieh, Diana Xiaobing Ma, Brian Sy-Yuan Shieh, Gerald Yin, Jennifer Y. Sun +2 more | 2005-09-27 |
| 6884464 | Methods for forming silicon comprising films using hexachlorodisilane in a single-wafer deposion chamber | R. Suryanarayanan Iyer, Janardhanan Anand Subramony, Errol Antonio C. Sanchez, Xiaoliang Jin, Aihua Chen +4 more | 2005-04-26 |