Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6753609 | Circuit probing contact pad formed on a bond pad in a flip chip package | Randy H. Y. Lo, Chun-Chi Ke | 2004-06-22 |
| 6692629 | Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer | Chih-Shun Chen, Po-Hao Yuan, Shih-Kuang Chiu, Ke Yang | 2004-02-17 |