Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821876 | Fabrication method of strengthening flip-chip solder bumps | — | 2004-11-23 |
| 6787903 | Semiconductor device with under bump metallurgy and method for fabricating the same | — | 2004-09-07 |
| 6774499 | Non-leaded semiconductor package and method of fabricating the same | — | 2004-08-10 |
| 6692629 | Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer | Chih-Shun Chen, Po-Hao Yuan, Shih-Kuang Chiu, Feng-Lung Chien | 2004-02-17 |