Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6713850 | Tape carrier package structure with dummy pads and dummy leads for package reinforcement | Chi-Chuan Wu, Chih-Shun Chen | 2004-03-30 |
| 6692629 | Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer | Chih-Shun Chen, Shih-Kuang Chiu, Feng-Lung Chien, Ke Yang | 2004-02-17 |