Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6798054 | Method of packaging multi chip module | Randy H. Y. Lo, Ssu-Cheng LAI | 2004-09-28 |
| 6781222 | Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof | Chian Ping Huang, Jui-Yu Chuang, Ho-Yi Tsai, Yude Chu | 2004-08-24 |
| 6764880 | Semiconductor package and fabricating method thereof | Chien-Ping Huang | 2004-07-20 |
| 6753602 | Semiconductor package with heat-dissipating structure and method of making the same | — | 2004-06-22 |
| 6731015 | Super low profile package with stacked dies | Tzong-Dar Her | 2004-05-04 |
| 6713850 | Tape carrier package structure with dummy pads and dummy leads for package reinforcement | Po-Hao Yuan, Chih-Shun Chen | 2004-03-30 |
| 6673690 | Method of mounting a passive component over an integrated circuit package substrate | Jui-Yu Chuang | 2004-01-06 |