Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6798054 | Method of packaging multi chip module | Chi-Chuan Wu, Ssu-Cheng LAI | 2004-09-28 |
| 6753609 | Circuit probing contact pad formed on a bond pad in a flip chip package | Feng-Lung Chien, Chun-Chi Ke | 2004-06-22 |