Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6753609 | Circuit probing contact pad formed on a bond pad in a flip chip package | Feng-Lung Chien, Randy H. Y. Lo | 2004-06-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6753609 | Circuit probing contact pad formed on a bond pad in a flip chip package | Feng-Lung Chien, Randy H. Y. Lo | 2004-06-22 |