Issued Patents 2004
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830957 | Method of fabricating BGA packages | Han-Ping Pu, Chih-Ming Huang | 2004-12-14 |
| 6828665 | Module device of stacked semiconductor packages and method for fabricating the same | Han-Ping Pu, Chih-Ming Huang | 2004-12-07 |
| 6812063 | Semiconductor package and fabricating method thereof | — | 2004-11-02 |
| 6806565 | Lead-frame-based semiconductor package and fabrication method thereof | Holman Chen, Chin-Yuan Hong, Jui-Hsiang Hung, Chin-Teng Hsu | 2004-10-19 |
| 6787921 | Array structure of solder balls able to control collapse | — | 2004-09-07 |
| 6784019 | Intercrossedly-stacked dual-chip semiconductor package and method of fabricating the same | — | 2004-08-31 |
| 6781245 | Array structure of solder balls able to control collapse | — | 2004-08-24 |
| 6777819 | Semiconductor package with flash-proof device | — | 2004-08-17 |
| 6770959 | Semiconductor package without substrate and method of manufacturing same | Raymond Jao | 2004-08-03 |
| 6767753 | Image sensor of a quad flat package | — | 2004-07-27 |
| 6764880 | Semiconductor package and fabricating method thereof | Chi-Chuan Wu | 2004-07-20 |
| D492314 | IC card type circuit module | Chih-Ming Huang, Jui-Yu Chuang, Lien-Chi Chan, Cheng-Hsu Hsiao | 2004-06-29 |
| 6756684 | Flip-chip ball grid array semiconductor package with heat-dissipating device and method for fabricating the same | — | 2004-06-29 |
| 6753206 | Dual-chip integrated circuit package with unaligned chip arrangement and method of manufacturing the same | Lian-Cherng Chiang, Michael Chang | 2004-06-22 |
| 6750533 | Substrate with dam bar structure for smooth flow of encapsulating resin | Yu-Po Wang, Chung-Chi Lin | 2004-06-15 |
| 6743706 | Integrated circuit package configuration having an encapsulating body with a flanged portion and an encapsulating mold for molding the encapsulating body | — | 2004-06-01 |
| 6740978 | Chip package capable of reducing moisture penetration | Chih-Chin Liao, Yung-Kang Chu | 2004-05-25 |
| 6720649 | Semiconductor package with heat dissipating structure | — | 2004-04-13 |
| 6713864 | Semiconductor package for enhancing heat dissipation | — | 2004-03-30 |
| 6713321 | Super low profile package with high efficiency of heat dissipation | Tzong-Dar Her | 2004-03-30 |
| 6707167 | Semiconductor package with crack-preventing member | Tzong-Da Ho | 2004-03-16 |
| 6703698 | Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same | Chih-Ming Huang | 2004-03-09 |
| 6703691 | Quad flat non-leaded semiconductor package and method of fabricating the same | Nan-Jang Chen, Kevin Chiang, Tzong-Da Ho | 2004-03-09 |
| 6699731 | Substrate of semiconductor package | Tzong-Da Ho, Chen-Hsu Hsiao | 2004-03-02 |
| 6700204 | Substrate for accommodating passive component | Chien-Te Chen | 2004-03-02 |