Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6819565 | Cavity-down ball grid array semiconductor package with heat spreader | Nai-Hao Kao, Wen-Jung Chiang | 2004-11-16 |
| 6750067 | Microelectronic piezoelectric structure and method of forming the same | Ramoothy Ramesh, Jeffrey M. Finder, Kurt Eisenbeiser, Zhiyi Yu, Ravindranath Droopad | 2004-06-15 |
| 6750533 | Substrate with dam bar structure for smooth flow of encapsulating resin | Chung-Chi Lin, Chien-Ping Huang | 2004-06-15 |