Issued Patents 2004
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6696750 | Semiconductor package with heat dissipating structure | Cha-Yun Yin, Ming-Chun Laio, Fu Tang | 2004-02-24 |
| 6689636 | Semiconductor device and fabrication method of the same | Chih-Chin Liao, Han-Ping Pu | 2004-02-10 |
| 6677665 | Dual-die integrated circuit package | — | 2004-01-13 |