ML

Ming-Chun Laio

SC Siliconware Precision Industries Co.: 1 patents #29 of 67Top 45%
Overall (2004): #153,076 of 270,089Top 60%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6696750 Semiconductor package with heat dissipating structure Cha-Yun Yin, Fu Tang, Chien-Ping Huang 2004-02-24