Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6696750 | Semiconductor package with heat dissipating structure | Cha-Yun Yin, Ming-Chun Laio, Chien-Ping Huang | 2004-02-24 |
| 6696752 | Encapsulated semiconductor device with flash-proof structure | Guo-Kai Su | 2004-02-24 |