Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830957 | Method of fabricating BGA packages | Chien-Ping Huang, Chih-Ming Huang | 2004-12-14 |
| 6828665 | Module device of stacked semiconductor packages and method for fabricating the same | Chih-Ming Huang, Chien-Ping Huang | 2004-12-07 |
| 6787918 | Substrate structure of flip chip package | Ying-Chou Tsai, Shih-Kuang Chiu | 2004-09-07 |
| 6689636 | Semiconductor device and fabrication method of the same | Chih-Chin Liao, Chien-Ping Huang | 2004-02-10 |