Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787918 | Substrate structure of flip chip package | Han-Ping Pu, Shih-Kuang Chiu | 2004-09-07 |
| 6772512 | Method of fabricating a flip-chip ball-grid-array package without causing mold flash | Jen-Yi Tsai | 2004-08-10 |