Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787918 | Substrate structure of flip chip package | Ying-Chou Tsai, Han-Ping Pu | 2004-09-07 |
| 6692629 | Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer | Chih-Shun Chen, Po-Hao Yuan, Feng-Lung Chien, Ke Yang | 2004-02-17 |