Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6731015 | Super low profile package with stacked dies | Chi-Chuan Wu | 2004-05-04 |
| 6713321 | Super low profile package with high efficiency of heat dissipation | Chien-Ping Huang | 2004-03-30 |