Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6811675 | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece | — | 2004-11-02 |
| 6806186 | Submicron metallization using electrochemical deposition | Lyndon Graham, Thomas Ritzdorf, Dakin Fulton, Robert W. Batz, Jr. | 2004-10-19 |
| 6743719 | Method for forming a conductive copper structure | Jiong-Ping Lu, Changfeng Xia | 2004-06-01 |
| 6730597 | Pre-ECD wet surface modification to improve wettability and reduced void defect | Jiong-Ping Lu, David Gonzalez, Honglin Guo | 2004-05-04 |
| 6699373 | Apparatus for processing the surface of a microelectronic workpiece | Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, John M. Pedersen, Vladimir Zila | 2004-03-02 |