Issued Patents 2004
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831008 | Nickel silicide—silicon nitride adhesion through surface passivation | Glenn J. Tessmer, Melissa Hewson, Donald Miles, Ralf B. Willecke, Andrew John McKerrow +2 more | 2004-12-14 |
| 6800547 | Integrated circuit dielectric and method | Changming Jin | 2004-10-05 |
| 6787429 | High-K dielectric materials and processes for manufacturing them | Ming-Jang Hwang | 2004-09-07 |
| 6784093 | Copper surface passivation during semiconductor manufacturing | Changfeng Xia | 2004-08-31 |
| 6784104 | Method for improved cu electroplating in integrated circuit fabrication | Qing Jiang | 2004-08-31 |
| 6743719 | Method for forming a conductive copper structure | Linlin Chen, Changfeng Xia | 2004-06-01 |
| 6734099 | System for preventing excess silicon consumption in ultra shallow junctions | Jin Zhao, Yuqing Xu | 2004-05-11 |
| 6730597 | Pre-ECD wet surface modification to improve wettability and reduced void defect | Linlin Chen, David Gonzalez, Honglin Guo | 2004-05-04 |
| 6709974 | Method of preventing seam defects in isolated lines | David Permana, Albert Cheng, Jeff West, Brock W. Fairchild, Scott Alexander JOHANNESMEYER +3 more | 2004-03-23 |
| 6680249 | Si-rich surface layer capped diffusion barriers | Wei-Yung Hsu, Qi-Zhong Hong, Richard Allen Faust | 2004-01-20 |