Issued Patents 2004
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825428 | Protected switch and techniques to manufacture the same | Yuegang Zhang | 2004-11-30 |
| 6825063 | Integrated core microelectronic package | Quat Vu, Jian Li, Maria V. Henao, Chun Mu | 2004-11-30 |
| 6822535 | Film bulk acoustic resonator structure and method of making | Li-Peng Wang, Valluri Rao | 2004-11-23 |
| 6816035 | Forming film bulk acoustic resonator filters | Li-Peng Wang, Valluri Rao | 2004-11-09 |
| 6812810 | Bridges for microelectromechanical structures | Tsung-Kuan A. Chou | 2004-11-02 |
| 6812814 | Microelectromechanical (MEMS) switching apparatus | Valluri Rao, John Heck, Li-Peng Wang, Dong-sik Shim, Quan Tran | 2004-11-02 |
| 6808955 | Method of fabricating an integrated circuit that seals a MEMS device within a cavity | — | 2004-10-26 |
| 6809617 | Edge plated transmission line and switch integrally formed therewith | Joseph Hayden, Tsung-Kuan A. Chou, Quan Tran | 2004-10-26 |
| 6808954 | Vacuum-cavity MEMS resonator | Peng Cheng, Valluri Rao | 2004-10-26 |
| 6794223 | Structure and process for reducing die corner and edge stresses in microelectronic packages | Jim Maveety, Quan Tran | 2004-09-21 |
| 6787970 | Tuning of packaged film bulk acoustic resonator filters | Dong-sik Shim, Jose Maiz, Li-Peng Wang, Valluri Rao | 2004-09-07 |
| 6784524 | Stress shield for microelectronic dice | — | 2004-08-31 |
| 6764876 | Stress shield for microelectronic dice | — | 2004-07-20 |
| 6753747 | Integrated microsprings for high speed switches | — | 2004-06-22 |
| 6753639 | Micro-electromechanical structure resonator frequency adjustment using radiant energy trimming and laser/focused ion beam assisted deposition | Peng Cheng, Valluri Rao | 2004-06-22 |
| 6753582 | Buckling beam bi-stable microelectromechanical switch using electro-thermal actuation | — | 2004-06-22 |
| 6750078 | MEMS switch having hexsil beam and method of integrating MEMS switch with a chip | — | 2004-06-15 |
| 6747389 | Apparatus for adjusting the resonance frequency of a microelectromechanical (MEMS) resonator using tensile/compressive strain and applications therefor | Andy Berlin | 2004-06-08 |
| 6737754 | COF packaged semiconductor | Jin Lee, Chun Mu, Quat Vu, Jian Li, Larry E. Mosley | 2004-05-18 |
| 6713859 | Direct build-up layer on an encapsulated die package having a moisture barrier structure | — | 2004-03-30 |
| 6709898 | Die-in-heat spreader microelectronic package | Harry Fujimoto, Steven Towle, John E. Evert | 2004-03-23 |
| 6706981 | Techniques to fabricate a reliable opposing contact structure | Kramadhati V. Ravi, Valluri Rao | 2004-03-16 |
| 6686820 | Microelectromechanical (MEMS) switching apparatus | Valluri Rao, John Heck, Li-Peng Wang, Dong-sik Shim, Quan Tran | 2004-02-03 |
| 6673697 | Packaging microelectromechanical structures | Valluri Rao, Li-Peng Wang, John Heck, Quan Tran | 2004-01-06 |