Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825063 | Integrated core microelectronic package | Jian Li, Qing Ma, Maria V. Henao, Chun Mu | 2004-11-30 |
| 6790704 | Method for capacitively coupling electronic devices | Brian S. Doyle, David B. Fraser | 2004-09-14 |
| 6737754 | COF packaged semiconductor | Qing Ma, Jin Lee, Chun Mu, Jian Li, Larry E. Mosley | 2004-05-18 |
| 6734534 | Microelectronic substrate with integrated devices | Jian Li, Steven Towle | 2004-05-11 |