Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825063 | Integrated core microelectronic package | Quat Vu, Jian Li, Qing Ma, Maria V. Henao | 2004-11-30 |
| 6743664 | Flip-chip on flex for high performance packaging applications | Chunlin Liang, Larry E. Mosley | 2004-06-01 |
| 6737754 | COF packaged semiconductor | Qing Ma, Jin Lee, Quat Vu, Jian Li, Larry E. Mosley | 2004-05-18 |