Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825063 | Integrated core microelectronic package | Quat Vu, Qing Ma, Maria V. Henao, Chun Mu | 2004-11-30 |
| 6802445 | Cost effective substrate fabrication for flip-chip packages | Il Kwon Shim, Sheila Marie L. Alvarez | 2004-10-12 |
| 6798003 | Reliable adhesion layer interface structure for polymer memory electrode and method of making same | Xiao-Chun Mu | 2004-09-28 |
| 6774640 | Test coupon pattern design to control multilayer saw singulated plastic ball grid array substrate mis-registration | — | 2004-08-10 |
| 6756620 | Low-voltage and interface damage-free polymer memory device | Xiao-Chun Mu, Mark Isenberger | 2004-06-29 |
| 6737754 | COF packaged semiconductor | Qing Ma, Jin Lee, Chun Mu, Quat Vu, Larry E. Mosley | 2004-05-18 |
| 6734534 | Microelectronic substrate with integrated devices | Quat Vu, Steven Towle | 2004-05-11 |