Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825067 | Mold cap anchoring method for molded flex BGA packages | Virgil Ararao, Hermes T. Apale | 2004-11-30 |
| 6818981 | Heat spreader interconnect for thermally enhanced PBGA packages | Hermes T. Apale, Gerry Balanon | 2004-11-16 |
| 6802445 | Cost effective substrate fabrication for flip-chip packages | Jian Li, Sheila Marie L. Alvarez | 2004-10-12 |
| 6798049 | Semiconductor package and method for fabricating the same | Won Sun Shin, Do Sung Chun, Seon Goo Lee, Vincent DiCaprio | 2004-09-28 |
| 6775140 | Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices | Seng Guan Chow, Virgil Ararao, Sheila Marie L. Alvarez, Roger Emigh | 2004-08-10 |
| 6737298 | Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same | Hermes T. Apale, Weddle Aquien, Dario S. Filoteo, Jr., Virgil Ararao, Leo A. Merilo | 2004-05-18 |
| 6706563 | Heat spreader interconnect methodology for thermally enhanced PBGA packages | Hermes T. Apale, Gerry Balanon | 2004-03-16 |
| 6683377 | Multi-stacked memory package | Vincent DiCaprio | 2004-01-27 |