Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825067 | Mold cap anchoring method for molded flex BGA packages | Hermes T. Apale, Il Kwon Shim | 2004-11-30 |
| 6775140 | Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices | Il Kwon Shim, Seng Guan Chow, Sheila Marie L. Alvarez, Roger Emigh | 2004-08-10 |
| 6737298 | Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same | Il Kwon Shim, Hermes T. Apale, Weddle Aquien, Dario S. Filoteo, Jr., Leo A. Merilo | 2004-05-18 |