Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6805974 | Lead-free tin-silver-copper alloy solder composition | Won Kook Choi, Charles C. Goldsmith, Timothy A. Gosselin, Donald W. Henderson, Sung Kwon Kang +1 more | 2004-10-19 |
| 6722032 | Method of forming a structure for electronic devices contact locations | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott | 2004-04-20 |
| 6708403 | Angled flying lead wire bonding process | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro | 2004-03-23 |