Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6824643 | Method and device of peeling semiconductor device using annular contact members | Kazuhiro Yoshimoto, Kazuo Teshirogi | 2004-11-30 |
| 6774650 | Probe card and method of testing wafer having a plurality of semiconductor devices | Shigeyuki Maruyama, Daisuke Koizumi, Naoyuki Watanabe, Yoshito Konno, Toshiyuki Honda +2 more | 2004-08-10 |
| 6750074 | Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig | Kazuo Teshirogi, Yuzo Shimobeppu, Kazuhiro Yoshimoto, Mitsuhisa Watanabe, Yoshiaki Shinjo +1 more | 2004-06-15 |
| 6732911 | Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system | Hirohisa Matsuki, Hiroyuki Matsui, Takao Ohno, Koki Otake, Akiyo Mizutani +3 more | 2004-05-11 |