Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6732911 | Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system | Hirohisa Matsuki, Hiroyuki Matsui, Eiji Yoshida, Koki Otake, Akiyo Mizutani +3 more | 2004-05-11 |
| 6673654 | Method of manufacturing semiconductor device using heated conveyance member | Koichi Meguro, Shigeru Kamada, Keisuke Fukuda, Yuzo Shimobeppu | 2004-01-06 |