Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836025 | Semiconductor device configured to be surface mountable | Tetsuya Fujisawa, Osamu Igawa, Yoshitaka Aiba, Masamitsu Ikumo, Mitsutaka Sato | 2004-12-28 |
| 6784543 | External connection terminal and semiconductor device | Yutaka Makino, Masamitsu Ikumo, Mitsutaka Sato, Tetsuya Fujisawa, Yoshitaka Aiba | 2004-08-31 |
| 6784542 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Kenichi Nagashige, Yuzo Hamanaka, Muneharu Morioka | 2004-08-31 |
| 6734042 | Semiconductor device and method for fabricating the same | Masamitsu Ikumo | 2004-05-11 |
| 6732911 | Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system | Hiroyuki Matsui, Eiji Yoshida, Takao Ohno, Koki Otake, Akiyo Mizutani +3 more | 2004-05-11 |
| 6696754 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more | 2004-02-24 |
| 6680241 | Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices | Tadahiro Okamoto | 2004-01-20 |