Issued Patents 2003
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664621 | Semiconductor chip package with interconnect structure | John W. Smith | 2003-12-16 |
| 6664484 | Components with releasable leads | Konstantine Karavakis | 2003-12-16 |
| 6657871 | Multiple channel modules and bus systems using same | Donald V. Perino, Sayeh Khalili | 2003-12-02 |
| 6651321 | Microelectronic joining processes | Masud Beroz, Klaus Wolter | 2003-11-25 |
| 6590781 | Clock routing in multiple channel modules and bus systems | Ravindranath Kollipara, David Nguyen | 2003-07-08 |
| 6572781 | Microelectronic packaging methods and components | — | 2003-06-03 |
| 6557253 | Method of making components with releasable leads | Konstantine Karavakis | 2003-05-06 |
| 6545875 | Multiple channel modules and bus systems using same | Donald V. Perino, Sayeh Khalili | 2003-04-08 |
| 6543131 | Microelectronic joining processes with temporary securement | Masud Beroz | 2003-04-08 |
| 6541845 | Components with releasable leads and methods of making releasable leads | Masud Beroz, Thomas H. DiStefano, Anthony B. Faraci, Joseph Fjelstad | 2003-04-01 |
| 6518160 | Method of manufacturing connection components using a plasma patterned mask | Joseph Fjelstad, David Light | 2003-02-11 |
| 6518091 | Method of making anisotropic conductive elements for use in microelectronic packaging | — | 2003-02-11 |
| 6514794 | Redistributed bond pads in stacked integrated circuit die package | Donald V. Perino, Sayeh Khalili | 2003-02-04 |