Issued Patents 2003
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664621 | Semiconductor chip package with interconnect structure | Belgacem Haba | 2003-12-16 |
| D481226 | Partition insert | Thomas Overthun, James N. Ludwig, David M. Gresham, Karl-Heinz Mueller, Monika Conway +1 more | 2003-10-28 |
| 6635553 | Microelectronic assemblies with multiple leads | Thomas H. DiStefano | 2003-10-21 |
| 6627478 | Method of making a microelectronic assembly with multiple lead deformation using differential thermal expansion/contraction | Christopher M. Pickett | 2003-09-30 |
| 6603209 | Compliant integrated circuit package | Thomas H. DiStefano, Konstantine Karavakis, Craig Mitchell | 2003-08-05 |
| 6589819 | Microelectronic packages having an array of resilient leads and methods therefor | Bruce M. McWilliams | 2003-07-08 |
| 6586955 | Methods and structures for electronic probing arrays | Joseph Fjelstad | 2003-07-01 |
| 6570101 | Lead configurations | Thomas Di Stefano | 2003-05-27 |
| D473517 | Partition insert | Thomas Overthun, James N. Ludwig, David M. Gresham, Karl-Heinz Mueller, Monika Conway +1 more | 2003-04-22 |
| 6541852 | Framed sheets | Masud Beroz, Thomas H. DiStefano | 2003-04-01 |
| 6525429 | Methods of making microelectronic assemblies including compliant interfaces | Zlata Kovac, Craig Mitchell, Thomas H. DiStefano | 2003-02-25 |
| 6518662 | Method of assembling a semiconductor chip package | Joseph Fjelstad | 2003-02-11 |