Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6602740 | Encapsulation of microelectronic assemblies | — | 2003-08-05 |
| 6603209 | Compliant integrated circuit package | Thomas H. DiStefano, Konstantine Karavakis, John W. Smith | 2003-08-05 |
| 6541874 | Encapsulation of microelectronic assemblies | Tan Nguyen, Thomas H. DiStefano | 2003-04-01 |
| 6525429 | Methods of making microelectronic assemblies including compliant interfaces | Zlata Kovac, Thomas H. DiStefano, John W. Smith | 2003-02-25 |
| 6521480 | Method for making a semiconductor chip package | Mike Warner, Jim Behlen | 2003-02-18 |