Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6534392 | Methods of making microelectronic assemblies using bonding stage and bonding stage therefor | Philip Damberg, Rene Kunz | 2003-03-18 |
| 6521480 | Method for making a semiconductor chip package | Craig Mitchell, Mike Warner | 2003-02-18 |