Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6653172 | Methods for providing void-free layers for semiconductor assemblies | Joseph Fjelstad | 2003-11-25 |
| 6635553 | Microelectronic assemblies with multiple leads | John W. Smith | 2003-10-21 |
| 6603209 | Compliant integrated circuit package | Konstantine Karavakis, Craig Mitchell, John W. Smith | 2003-08-05 |
| 6541874 | Encapsulation of microelectronic assemblies | Tan Nguyen, Craig Mitchell | 2003-04-01 |
| 6541845 | Components with releasable leads and methods of making releasable leads | Masud Beroz, Anthony B. Faraci, Joseph Fjelstad, Belgacem Haba | 2003-04-01 |
| 6541852 | Framed sheets | Masud Beroz, John W. Smith | 2003-04-01 |
| 6525429 | Methods of making microelectronic assemblies including compliant interfaces | Zlata Kovac, Craig Mitchell, John W. Smith | 2003-02-25 |