Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6653172 | Methods for providing void-free layers for semiconductor assemblies | Thomas H. DiStefano | 2003-11-25 |
| 6635514 | Compliant package with conductive elastomeric posts | — | 2003-10-21 |
| 6586955 | Methods and structures for electronic probing arrays | John W. Smith | 2003-07-01 |
| 6583444 | Semiconductor packages having light-sensitive chips | — | 2003-06-24 |
| 6573609 | Microelectronic component with rigid interposer | John P. Myers | 2003-06-03 |
| 6541867 | Microelectronic connector with planar elastomer sockets | — | 2003-04-01 |
| 6541845 | Components with releasable leads and methods of making releasable leads | Masud Beroz, Thomas H. DiStefano, Anthony B. Faraci, Belgacem Haba | 2003-04-01 |
| 6518160 | Method of manufacturing connection components using a plasma patterned mask | Belgacem Haba, David Light | 2003-02-11 |
| 6518662 | Method of assembling a semiconductor chip package | John W. Smith | 2003-02-11 |