Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6657871 | Multiple channel modules and bus systems using same | Donald V. Perino, Belgacem Haba | 2003-12-02 |
| 6621155 | Integrated circuit device having stacked dies and impedance balanced transmission lines | Donald V. Perino | 2003-09-16 |
| 6545875 | Multiple channel modules and bus systems using same | Donald V. Perino, Belgacem Haba | 2003-04-08 |
| 6514794 | Redistributed bond pads in stacked integrated circuit die package | Belgacem Haba, Donald V. Perino | 2003-02-04 |