Issued Patents 2003
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6657871 | Multiple channel modules and bus systems using same | Belgacem Haba, Sayeh Khalili | 2003-12-02 |
| 6657468 | Apparatus and method for controlling edge rates of digital signals | Scott C. Best | 2003-12-02 |
| 6619973 | Chip socket assembly and chip file assembly for semiconductor chips | Wayne S. Richardson, John B. Dillon | 2003-09-16 |
| 6621373 | Apparatus and method for utilizing a lossy dielectric substrate in a high speed digital system | Donald R. Mullen, Haw-Jyh Liaw | 2003-09-16 |
| 6621155 | Integrated circuit device having stacked dies and impedance balanced transmission lines | Sayeh Khalili | 2003-09-16 |
| 6589059 | Chip socket assembly and chip file assembly for semiconductor chips | Wayne S. Richardson, John B. Dillon | 2003-07-08 |
| 6583035 | Semiconductor package with a controlled impedance bus and method of forming same | Nader Gamini | 2003-06-24 |
| 6545875 | Multiple channel modules and bus systems using same | Belgacem Haba, Sayeh Khalili | 2003-04-08 |
| 6530062 | Active impedance compensation | Haw-Jyh Liaw, Pak Shing Chau, Kevin S. Donnelly | 2003-03-04 |
| 6514794 | Redistributed bond pads in stacked integrated circuit die package | Belgacem Haba, Sayeh Khalili | 2003-02-04 |
| 6504875 | Apparatus for multilevel signaling | John B. Dillon | 2003-01-07 |