Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649507 | Dual layer photoresist method for fabricating a mushroom bumping plating structure | Cheng-Yu Chu, Kuo-Wei Lin, Chiou-Shian Peng, Yang-Tung Fan, Fu-Jier Fan +1 more | 2003-11-18 |
| 6638688 | Selective electroplating method employing annular edge ring cathode electrode contact | Kai-Ming Ching, Sheng-Liang Pan, Hao-Wei Chang, Chun-Hong Chang | 2003-10-28 |
| 6636313 | Method of measuring photoresist and bump misalignment | Chia-Fu Lin, Kai-Ming Ching, Chao-Yuan Su, Hsin-Hui Lee, Li-Chih Chen | 2003-10-21 |
| 6632700 | Method to form a color image sensor cell while protecting the bonding pad structure from damage | Yang-Tung Fan, Cheng-Yu Chu, Chiou-Shian Peng, Shih-Jane Lin, Fu-Jier Fan +1 more | 2003-10-14 |
| 6605524 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng +1 more | 2003-08-12 |
| 6602775 | Method to improve reliability for flip-chip device for limiting pad design | Chia-Fu Lin, Kai-Ming Ching, Hsin-Hui Lee, Chao-Yuan Su, Li-Chi Chen | 2003-08-05 |
| 6583039 | Method of forming a bump on a copper pad | Kuo-Wei Lin, Cheng-Yu Chu, Yang-Tung Fan, Fu-Jier Fan, Shih-Jane Lin +2 more | 2003-06-24 |